MPO/MTP Polishing Slurry | Silica Polishing Slurry | Ceria Polishing Slurry | Alumina Polishing Slurry| Diamond Polishing Slurry| Silicon Carbide Polishing Slurry

Fiber Optic

Polishing slurry is a critical material for ultra-precision machining in the optical communication industry, widely adopted in the fabrication of fiber optic connectors, optical chips and optical components.

Chemical mechanical polishing (CMP) using nano-scale abrasive particles is performed on ceramic ferrules, silicon photonic wafers, lithium niobate crystals and other substrates to achieve atomic-level surface flatness. This process effectively reduces insertion loss and return loss, improves component coupling accuracy and signal transmission stability, making the slurry an essential auxiliary material underpinning the high-quality development of high-speed optical modules, data centers and 5G communication systems.

cases： 铭衍海（常州）微电子光纤端子二合一研磨液简介

Semiconductor

Semiconductor manufacturing processes are advancing toward smaller line widths and larger wafer sizes, imposing atomic-level requirements on planarization technologies for wafer substrates and chip fabrication. We supply CMP (Chemical Mechanical Polishing) consumables applicable to silicon wafers, silicon carbide, gallium nitride and other third-generation semiconductor materials. Featuring precise particle size control and stable chemical formulations, our polishing slurries deliver high material removal rates while achieving ultra-low defect density and nanometer-scale global planarity, serving as critical materials for guaranteeing chip yield and performance.

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Optical Glass

Optical crystals including YAG, laser crystals, calcium fluoride and various nonlinear optical crystals are generally hard, brittle and feature unique chemical properties, which makes conventional processing prone to stress layers and surface damage.

We offer customized ceria, diamond and silica polishing slurry systems. By optimizing the ratio of abrasive hardness and chemical medium, we achieve coordinated effects of hardness matching and chemical action.

Without impairing the intrinsic properties of crystals, our slurries efficiently eliminate processing stress and yield scratch-free, pit-free atomic-level optical surfaces, meeting the stringent requirements of lasers and high-end optical instruments.

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Ceramic

Precision ceramics are widely utilized for their high hardness, superior wear resistance and excellent high-temperature resistance. However, their inherent hard and brittle nature poses major challenges to post-processing procedures.

Our series of alumina, silicon carbide and diamond polishing slurries are specially engineered to tackle the difficult-to-machine properties of ceramic materials. Featuring strong cutting capacity and outstanding heat dissipation performance, these products effectively prevent edge chipping and microcracks during processing. They are extensively adopted for surface treatment of ceramic bearings, sealing rings, structural components and mobile phone backplates, enabling high-precision dimensional control and mirror-like surface gloss.

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3C

3C electronic products are evolving toward diversified materials (titanium alloy, aluminum alloy, glass, ceramics, etc.) and ultra-premium appearance standards, imposing stringent requirements on surface treatment processes.

We offer a comprehensive portfolio of polishing slurries, covering high-efficiency wire drawing and deburring for metal middle frames, high-gloss polishing for glass and ceramic backplates, as well as precision thinning for sapphire camera cover plates.

Our products are fully compatible with automated polishing equipment to boost production efficiency, delivering delicate tactile feel and superior visual texture.

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New Energy

In the new energy sector, photovoltaic silicon wafers, lithium battery anode materials and third-generation semiconductor power devices all impose new requirements on material surface quality and processing efficiency.

Our silicon carbide and diamond polishing slurry series feature high material removal rates and stable dispersion systems. They are widely applied in post-wire-cutting treatment of silicon wafers, thinning and polishing of silicon carbide substrates, and fine grinding of battery materials.

We help the new energy industry improve device performance and cut process energy consumption.

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Metal

We provide one-stop solutions for a wide range of metallic materials including stainless steel, aluminum alloy, titanium alloy, copper alloy and precious metals.

Our diamond and alumina polishing slurries can efficiently remove oxide layers, burrs and machining marks on metal surfaces, rapidly achieving high-gloss mirror finishes or uniform matte textures.

Boasting excellent wettability and easy cleanability, our products are suitable for automated or manual polishing of medical devices, precision molds, hardware fittings and automotive components.

cases： Diamond Polishing Slurry for Tungsten Carbide Mold Polishing 氧化铝抛光液用于不锈钢工件精密抛光案例

Others

Beyond mainstream application sectors, our polishing technologies also play a vital role in the processing of a wide variety of special materials.

With an in-depth grasp of abrasives science, material science and chemistry, we are capable of delivering customized polishing solutions for jewelry and jade, precision bearings, synthetic diamond, special alloys and various composite materials.

Whether your requirements stem from the special hardness and toughness of materials or unique specifications for final surface topography, we are committed to breaking through your processing bottlenecks and upgrading product quality via precise formula adjustments.

cases： Custom Polishing Fluid Complete Precision Polishing Solution for CD Discs