Our high purity ceria slurry is a high-performance precision polishing medium made of high-quality cerium oxide particles, with advanced dispersion technology to ensure excellent suspension stability and uniform particle size distribution. It features high chemical activity and mechanical polishing performance, suitable for various ultra-precision lapping and polishing processes in optical, semiconductor, precision instrumentation and other industries, providing stable and consistent polishing results for various materials.
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Excellent Polishing Performance
Provides uniform cutting, high polishing efficiency, effectively improves surface roughness, and enhances workpiece smoothness.
Water-Based, Environmentally Friendly System
Water-based formula, environmentally friendly and non-corrosive, safe to use, friendly to both the environment and equipment.
Strong Process Adaptability
Process-friendly, can be diluted for use according to processing requirements, adaptable to various polishing procedures.
Good Stability
Uniform dispersion, stable performance during use, ensuring consistent polishing results.
Controllable Source Quality
Direct
supply from the source factory with a complete production and quality
control system, ensuring reliable and consistent product quality.
MYHMICRO provides one-stop ultra-precision lapping and polishing solutions.
Storage conditions: Store in a cool, dry environment. Avoid high temperatures, direct sunlight, and freezing. Keep away from open flames and corrosive substances.
Usage instructions: It is recommended to stir evenly before use to prevent abrasive settling. Adjust the working concentration according to the actual process requirements.