Silica Slurry

High performance colloidal silica polishing slurry for ultra-precision lapping and polishing of various materials, delivering stable removal rate and ultra-smooth surface finish.

Leading Polishing Industry Solution Provider

Silica Slurry
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CONTACT US

Mingyanhai (Changzhou) Microelectronics Co., Ltd.

TEL
+86-15261158698 +86-15995062798

EMAIL
sales@myhmicro.com

ADDRESS
Room 601, Building 6 Changzhou Inspection & Testing Industrial Park Qinglong Subdistrict, Tianning District Changzhou City, Jiangsu Province Postal Code:213000

Silica Slurry

Product Overview

Our high purity silica slurry is a high-performance colloidal polishing medium formulated with monodisperse nano/micron silica particles, featuring excellent dispersion stability, uniform particle size distribution and controllable removal rate. It is widely used in ultra-precision lapping and polishing processes in semiconductor, optoelectronics, precision instrumentation and other industries, providing stable and consistent polishing results for various hard and brittle materials.

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APPLICATION

Semiconductor Wafer Fabrication Optical Glass Processing Ceramic Polishing Metal Surface Finishing Precision Instrument Manufacturing Optoelectronic Component Production

Product Features

  • Precise particle size with narrow distribution; efficient micron-level removal, deep-scratch free.
  • Great cutting power for hard & brittle materials; fast stock removal and high polishing efficiency.
  • Stable suspension: no delamination, sedimentation or agglomeration. Consistent batch performance and good repeatability.
  • Water-based, heavy metal & insoluble organics free. Easy to rinse with pure water.
  • Widely applicable for intermediate, rough and fine polishing. Compatible with mainstream machines and pads.

    • Storage Conditions & Methods

    Temperature: 5℃ ~ 35℃. Do not freeze (abrasives agglomerate and fail under 0℃) or overheat (system instability above 35℃). Store away from light.
    Prior to use: Stir fully for even abrasive distribution. Use directly or dilute with deionized water (1:1 ~ 1:8), then stir again.



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